论文和技术资料

D. Fu [1], L. Wang [2], J. Liao [1], S. Dus [1], K. Bearson [1],
[1] Tyson Foods, Downers Grove, IL, USA
[2] Simulprocess, Summerfield, NC, USA

G. Zhang [1], Y. Zhao [1], J. Brcka [2], J. Faguet [2],
[1] Clemson University, Clemson, SC, USA
[2] Tokyo Electron U.S. Holdings, Inc., Austin, TX, USA

A. Arevalo [1], D. Conchouso [1], D. Castro [1], M. Diaz [2], I. G. Foulds [3],
[1] CEMSE Division, King Abdullah University of Science and Technology, Thuwal, Saudi Arabia
[2] Physical Sciences and Engineering Division, King Abdullah University of Science and Technology, Thuwal, Saudi Arabia
[3] University of British Columbia, Vancouver, BC, Canada

M. M. Althobaiti [1], H. S. Salehi [2], Q. Zhu [2],
[1] Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
[2] Department of Electrical and Computer Engineering, University of Connecticut, Storrs, CT, USA

Y. Li [1], K. Nandakumar [1], M. Jain [1],
[1] Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, LA, USA

M. Gobbert [1], K. M. Kalayeh [2], J. S. Graf [1],
[1] Department of Mathematics and Statistics, University of Maryland - Baltimore County, Baltimore, MD, USA
[2] Department of Mechanical Engineering, University of Maryland - Baltimore County, Baltimore, MD, USA

M. S. Luloff [1], T. W. Krause [2], J. Morelli [1],
[1] Queen's University, Kingston, ON, Canada
[2] Royal Military College of Canada, Kingston, ON, Canada

R. S. Ritter [1], M. A. Fiddy [2],
[1] Olivet Nazarene University, Bourbonnais, IL, USA
[2] University of North Carolina - Charlotte, Charlotte, NC, USA

R. Balistreri [1],
[1] QSC Audio Products, LLC., Costa Mesa, CA, USA

X. Yu [1], C. Woodcock [1], Y. Peles [2], J. Plawsky [1],
[1] Rensselaer Polytechnic Institute, Troy, NY, USA
[2] University of Central Florida, Orlando, FL, USA