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查看 COMSOL 用户年会 2020 论文

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Bengaluru 2023

Munich 2023

Multiphysicsx

Cascades of Secondary Particles in High Voltage Accelerators

M. Cavenago[1], P. Antonini[1][3], P. Veltri[2], N. Pilan[2], V. Antoni[2], and G. Serianni[2]
[1]INFN-LNL, Legnaro, Padova, Italy
[2]Consorzio RFX, Padova, Italy
[3]Centro Ric. E. Fermi, Roma, Italy

A very simplified system for high voltage test is studied, considering reason for voltage holding failures ... 扩展阅读

Mobility of Catalytic Self-Propelled Nanorods Modeling with COMSOL Multiphysics^®

F. Lugli[1] and F. Zerbetto[1]
[1]Department of Chemistry “G. Ciamician”, Università di Bologna, Bologna, Italy

A small particle or a nano-sized object placed in a liquid is subject to random collisions with solvent ... 扩展阅读

Benefits of COMSOL Multiphysics^® Version 4

Ed Fontes
Chief Technology Officer, COMSOL

Ed Fontes is CTO at COMSOL with specific interest in the transport-reaction products. He has 14 years ... 扩展阅读

COMSOL Multiphysics^® Enhances Design Process at e2v technologies

Jan Przybyla
Technical Specialist, e2v technologies, England

Outline of presentation: We have seen a few of the diverse ways e2v has started to use COMSOL It is ... 扩展阅读

Phasefield Modeling of Ferroelectric Materials

Marc Kamlah
Head of the Mechanics of Materials Department, Forschungszentrum Karlsruhe, Germany

Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification ... 扩展阅读

COMSOL Multiphysics^® Version 4

Svante Littmarck
President and CEO, COMSOL

Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied ... 扩展阅读

Oxidation of Metallic Nanoparticles

A. Auge[1], A. Weddemann[1], F. Wittbracht[1], B. Vogel[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott ... 扩展阅读

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single ... 扩展阅读

Modelling of Micro/Macro Densification Phenomena of Cu Powder during Capacitor Discharge Sintering

G. Maizza[1] and A. Tassinari[1]

[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) ... 扩展阅读

Modelling of SiC Chemical Vapour Infiltration Process Assisted by Microwave Heating

G. Maizza[1] and M. Longhin[1]
[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor ... 扩展阅读

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