A. Traidia, and F. Roger
AREVA NP, Technical Center, Saint Marcel, France
ENSTA Paristech, Paris, France
Using COMSOL Multiphysics, a finite element model is introduced in this paper to describe the couplings between the welding arc and the weld pool dynamic in pulsed gas tungsten arc welding. The cathode, arc-plasma and melting anode regions are taken into account. The unified time-dependent model describes the heat transfer, fluid flow and electromagnetic fields in the three regions. The ...
F. Cacho, V. Fiori, C. Chappaz, C. Tavernier, and H. Jaouen
STMicroelectronics, Crolles, France
In advanced semiconductor devices, most of the reliability issues in interconnects occur at a local scale. More precisely, the voiding phenomenon in copper lines is one of the key issues. Hence, a better understanding of the mechanisms governing electromigration would enable the development of more accurate predictive models.A model of vacancy migration is proposed. The thermal, stress and ...
S. Prabhakar and J. Raynolds
College of NanoScale Science and Engineering, University at Albany, Albany, NY, USA
Non-charge-based logic is the notion that an electron can be trapped and its spin manipulated through application of gate voltages. Numerical simulations of Spin Single Electron Transistors (SSET) at University at Albany, aimed at practical development of post-CMOS concepts and devices is presented. We use COMSOL based multiphysics finite element simulation strategy to solve the ...
N. Elabbasi, J. Bergstrom, and S. Brown
Veryst Engineering, LLC.
Peristaltic pumping is an inherently nonlinear multiphysics problem where the deformation of the tube and the pumped fluid are strongly coupled. We used COMSOL Multiphysics to investigate the performance of a 180 degree rotary peristaltic pump with two metallic rollers, and an elastomeric tube pumping a viscous Newtonian fluid. The model captures the peristaltic flow, the flow fluctuations ...
A Finite Element Analysis of the Influence of Morphology on Barrier Properties of Polymer-Clay Nanocomposites
D. L. Statler Jr., and R. K. Gupta
Department of Chemical Engineering, West Virginia University, Morgantown, WV, USA
Nanocomposites, formed by dispersing a few weight-percent of nanometer-thick platelets of organically-coated montmorillonite clay in a variety of polymers, are being used in food packaging applications. The clay platelets reduce the diffusion coefficient of gases, such as carbon dioxide and water vapor, and prolong the shelf-life of packaged foods and carbonated beverages. Here we use the COMSOL ...
J. Crompton, S. Yushanov, L. Gritter, and K. Koppenhoefer
AltaSim Technologies, LLC.
Thermoelectric phenomena provide the direct conversion of heat into electricity or electricity into heat, the phenomena is described by three related mechanisms: the Seebeck, Peltier and Thomson effects. Thermoelectric devices have found many applications ranging from temperature measurement, solid state heating or cooling and direct energy conversion from waste heat. In this paper, analysis ...
Fluid-Structure Interaction Modeling for an Optimized Design of a Piezoelectric Energy Harvesting MEMS Generator
I. Kuehne, A. van der Linden, J. Seidel, M. Schreiter, L. Fromme, and A. Frey
Siemens AG, Corporate Research & Technologies, Munich, Germany
Comsol Multiphysics GmbH, Göttingen, Germany
This paper reports the design of a piezoelectric energy harvesting micro generator for an energy autonomous tire pressure monitoring wireless sensor node. For our design we use a piezoelectric MEMS generator approach without additional mass. The intrinsic mass of the cantilever is in the microgram region and the resulting acceleration forces are very small. The generator has a triangular ...
TEL Technology Center, America, LLC
Hydrogen plasma is typically used in the semiconductor industry for materials processing, surface preparation and cleaning of silicon wafers and thin films. In this contribution, we developed a 2D/3D plasma fluid model as described by the set of the species and energy balance equations in a generic semiconductor tool chamber with remote Inductively Coupled Plasma (ICP) source. Background ...
P. Seshaiyer, K. Nong, S. Garcia, E. Aulisa, and E. Swim
George Mason University, Farifax, VA, USA
United States Naval Academy, Annapolis, MD, USA
Texas Tech University, Lubbock, TX, USA
Sam Houston State University, Huntsville, TX, USA
Efficient modeling and computation of the nonlinear interaction of fluid with a solid undergoing nonlinear deformation has remained a challenging problem in computational science and engineering. Direct numerical simulation of the non-linear equations, governing even the most simplified fluid-structure interaction model depends on the convergence of iterative solvers which in turn relies heavily ...
Applying Grain Continuum Models to Stress Induced Grain Evolution in Next Generation Integrated Circuit Interconnects
D.N. Bentz, M. Bloomfield, J-Q. Lu, R.J. Gutmann, and T.S. Cale
Focus Center—New York, Rensselaer: Interconnects for Hyperintegration
We discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. COMSOL Multiphysics is used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. The grain boundary speeds are computed using a simple model that relates them to grain boundary mobility and differences ...