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查看 COMSOL 用户年会 2020 论文

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Bengaluru 2023

Munich 2023

MEMS and Nanotechnologyx

Finite Element Modeling of an AlGaN/GaN Based VOC Sensor Using COMSOL®

B. Uppalapati¹, G. Koley¹, A. Kota²
¹Clemson University, Clemson, SC, USA
²University of Dayton, Dayton, OH, USA

Volatile organic compounds (VOCs) are a large group of chemicals that can be found in many products that we ... 扩展阅读

Understanding the Physics of Droplet Electrocoalescence in a Microtrap

B. Koppolu¹, S. P. Burugupally¹, F. B. Memon¹
¹Wichita State University, Wichita, KS, USA

Droplet-based microfluidic systems are emerging as an ideal platform for the high-throughput screening of ... 扩展阅读

A Preliminary Design of a Hydrodynamic Microtrap for Capturing Aqueous Droplets in Oil Media

E. McDaniel¹, S. P. Burugupally¹
¹Wichita State University, Wichita, KS, USA

Droplet-based microfluidic systems are emerging as an ideal platform for the high-throughput screening of ... 扩展阅读

Optimization of Piezoelectric-Triboelectric Hybrid Generator Design

M. Padmanabhan¹, G. Barbosa¹
¹Rhode Island College, Providence, RI, USA

Devices which scavenge energy from ambient mechanical sources such as human body movement and ocean waves are ... 扩展阅读

Critical Temperature Control of Silicon Micro-Reactors for Lab-On-Chip Applications

S. Paul[1], A. Das[2], A. Bhattacharya[2]
[1]CRNN,University of Calcutta, India
[2]Radio Physics and Electronics, University of Calcutta, India

The development of microfluidic components for implementation of a lab-on-chip system requires both fluid ... 扩展阅读

Comparison of Dispersion Model for Spheres of Varying Geometry

M. Kalane[1], S. Mishra[1], S. Dhar[1], V. Shenoy[1], N. Sakpal[2], A. Agwan[2], S. Patwardhan[1]
[1]MITWPU, Pune, India
[2]Techniche Engineering Private Limited, India

Manufacturing of an apparatus for experimental purpose pose certain difficulties due to the process involved. ... 扩展阅读

Electrothermal Study of Cu-CNT Composite TSV Using COMSOL Multiphysics®

K. Sable[1], B. Kumari[2], M. Sahoo[3]
[1]M.Tech Scholar, Indian Institute of Technology Dhanbad., India
[2]SRF, Indian Institute of Technology Dhanbad., India
[3]Assistant Professor, Indian Institute of Technology Dhanbad., India

Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to ... 扩展阅读

Design and Simulation of a Dual Axis Thermal Accelerometer using Single Axis Structure

R. Mukherjee[1], P. Mandal[2], P. Guha[2]
[1]Bennett University, India
[2]IIT Kharagpur, India

An accelerometer detects acceleration and tilt of a device. There are several areas where accelerometers are ... 扩展阅读

FEM Simulation of Interdigitated Electrodes (IDEs) Device

S. Deshpande[1], S. Bhand[1], G. Bacher[1]
[1]BITS Pilani K K Birla Goa Campus, India

In this, FEM simulation of the interdigitated electrodes (IDEs) device using COMSOL Multiphysics® is ... 扩展阅读

Lithium Niobate SAW devices for Multi-parameter Sensing : Modeling and Simulation Studies Using COMSOL Multiphysics®

R. Srivastava[1], S. Kale[1]
[1]Defence Institute Of Advanced Technology, India

Surface Acoustic Wave devices are classic examples of Micro Electro Mechanical Systems (MEMS). These devices ... 扩展阅读

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