V. Valente, A. Demosthenous, and R. Bayford
Department of Electronic & Electrical Engineering, University College London, London, United Kingdom
Department of Natural Sciences, Middlesex University, London, United Kingdom
Deep Brain Stimulation (DBS) is a therapeutic tool used for a number of neurological disorders including chronic pain, incontinence and movement disorders, such as Parkinson’s disease. DBS consists of the low-frequency stimulation of an area of the brain, known as basal ganglia. The stimulation is provided by clinical implant, consisting of a pulse generator and an electrode lead ...
O. Krol, N. Weiss, F. Sawo, and T. Bernard
Fraunhofer Institute for Information and Data Processing, Karlsruhe, Germany
In this paper we present a novel approach for modeling spatial distributed bio- chemical and environmental processes like the growth of plants and the related biochemical reactions. The physical phenomena like flow and mass transport can be described by fluid dynamics equations, but for effects like growth rates often no analytic models are available. However, in many cases experts have knowledge ...
R. Winz, N. Schröder, W. Wiechert, and E. von Lieres
Institute of Biotechnology 2, Research Centre Jülich, Jülich, Germany
Research Center for Micro and Nanochemistry, University of Siegen, Siegen, Germany
In recent years lab-on-microchip technology has become a powerful tool for micro-scale analysis of biochemical processes. In the studied system the overall process consists of transport, convection, diffusion, reaction and adsorption processes. Two compounds A and B, contained in a carrier fluid (buffer), are introduced into a reaction channel via a Y-shaped double-inlet. As the streams flow ...
President and CEO, COMSOL
Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied Mathematics from the Royal Institute of Technology in Stockholm. In 2004 he received an honorary doctoral degree from the Royal Institute of Technology.
P.A. Koski and M.S. Mikkola
Department of Applied Physics, Helsinki University of Technology, Espoo, Finland
A 3D FEM (Finite Element Method) model for predicting the internal pressure distribution of a fuel cell stack is presented. The model includes contact pair boundary conditions between the most critical components, thermal expansion and Young's moduli as a function of temperature. The model is used to investigate the changes in pressure distribution inside a PEM fuel cell at realistic temperatures ...
L. Martinelli, A. Lamberti, and P. Ruol
DISTART Idraulica, Università di Bologna, Bologna, Italy
IMAGE, Università di Padova, Padova, Italy
Objective of this contribution is to present a procedure for evaluating second order drift forces on floating bodies, often the most important loading component for mooring design, in case of high waves propagating in relatively shallow water depths. The non linearity associated to this condition, which is typical of installations involving wave energy converters, makes this problem particularly ...
A. Di Carlo, V. Sansalone, A. Tatone, and V. Varano
Modelling and Simulation Lab, Università Roma Tre, Roma, Italy
Laboratoire de Mécanique Physique, Université Paris Est, Paris, France
DISAT, Università degli Studi dell’Aquila, L'Aquila, Italy
We present a mechanical model a growing spherical shell suitable for predicting the evolution of a Saccular Cerebral Artery Aneurysms (SCAA). It relies basically on the Kröner-Lee decomposition, used to describe the interplay between the current and the relaxed configuration of body elements. Rupture or stabilization of a SCAA are the end effect of a number of biological mechanisms, still poorly ...
P. Franciosa and S. Gerbino
Faculty of Engineering, University of Naples Federico II, Napoli, Italy
Faculty of Engineering, University of Molise, Campobasso, Italy
Tessellated models are more and more used in several engineering fields. The need to use such models to quickly perform computer simulations related to coupled physical phenomena, implies the use of dedicated software, allowing to solve, into an integrated environment, multiphysics problems. In the present work, COMSOL Multiphysics® has been used and its ability to handle tessellated models ...
G.S. Durante and M. Fretz
CSEM Zentralschweiz, Alpnach Dorf, Switzerland
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...