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COMSOL Multiphysics 案例库模型来自广泛的应用领域,包括电气、机械、流体和化工等行业。您可以下载现成即可使用的模型,以及详细的建模步骤说明,作为您建模工作的起点。请使用“快速搜索”查找与您的专业领域相关的模型,并登录或创建一个与有效的 COMSOL 许可证相关联的 COMSOL Access 帐户,下载模型文件。

Rotating Cylinder Hull Cell

Rotating Cylinder hull cells are an important experimental tool in electroplating and electrodeposition and are used for the measurement of non-uniform current distribution, mass transport and throwing power of plating baths. The model reproduces the results for a commercially available cell (RotaHull(R)) as published in paper [1]. In particular, it investigates the primary, secondary and ...

Electrodeposition of a Microconnector Bump

This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal displays (LCDs) and driver chips. The location of the bumps on the electrode surface is controlled by the use ...

Buoyancy–driven μPCR for DNA Amplification

Polymerase chain reaction (PCR) is one of the most effective methods in molecular biology, medical diagnostics, and biochemical engineering in amplifying a specific sequence of DNA. There has been a great interest in developing portable PCR-based lab-on-a-chip systems for point-of-care applications and one strategy that seems very promising is natural convection-based PCR. This model studies ...

Electrode Growth Next to an Insulator

This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between the growing electrode and the insulator.

Fountain Flow Effects on Electrodeposition on a Rotating Wafer

This example extends the analysis made in the model Electrodeposition on a Resistive Patterned Wafer by including the diffusion and convection of copper ions in the electrolyte. The coupled mass transport convection-diffusion effects are of interest in this type of reactor since they will be accentuated towards the rim of the wafer, limiting the current density. This will counter balance the ...

Electrocoating of a Car Door

This example models electrocoating of paint onto a car door in a time-dependent simulation. The deposited paint is highly resistive which results in lowered local deposition rates for coated areas. A primary current distribution in combination with a film resistance model is used to describe the charge transport in the electrolyte. The model is in 3D and uses an imported CAD geometry.

Electrodeposition of a Microconnector Bump in 3D

This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer expression. The model is an extension to 3D of the Electrodeposition of a Microconnector Bump in 2D example.

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